5G终端产品设计及挑战 Why 5G?- Higherbandwidths (available at higher frequencies)- Many of thesefrequency ranges are largely untapped in terms of current wireless traffic(avoid overcrowding and interference issues )MajorChallenges:- Smaller physicalsize scales, shorter wavelengths, higher design sensitivities- Temperatureimpact becomes significant- Largerelectromagnetic losses- Difficult-to-characterizefrequency dependence of material properties- More pronouncedwave effects of the EM fields at smaller wavelengths
Ansys电-热-力解决方案介绍
AnsysMultiphysics Technologies for Electronic Systems ReliabilityElectro-ThermalSolutions-Thermal analysisis tightly integrated with ANSYS’s Electromagnetic (EM) solversThermalaware Reliability Analysis on ChipAnsysWorkbench Scheme for Warpage Analysis Process（Thermal-Stress）
Ansys电-热-力仿真案例
手机中PCB热力可靠性分析Stress andStrain Analysis of Solderball
