阵列天线贴片间的解耦的方法汇总

减少贴片天线间互耦的技术主要包括减少表面波耦合、引入带阻响应、改变耦合模式、网络解耦以及利用自然场特性等方法。每种方法都有其适用场景和优缺点，需要根据具体的应用需求和天线布局来选择合适的技术。

这些技术可以大致分为几类：

1、减少表面波耦合：

当贴片天线相距较远时，表面波是互耦的主要因素。通过设计来减少表面波的传播，可以有效提高天线间的隔离度。这种方法适用于天线间距相对较大的情况。

参考文献[1]-[5]

2、引入带阻响应：

在需要的频段内，通过在天线之间引入带阻元件（如谐振器、槽结构等），可以产生带阻响应，从而减少该频段的互耦。这种方法不需要额外的空间，但设计复杂度较高。

参考文献[6]-[10]

3、改变耦合模式：

使用特定结构（如近场谐振器、极化转换隔离器等）来改变天线之间的耦合模式，从而降低互耦。这种方法可能需要特定的设计来匹配天线的特性和工作频段。

参考文献[11]-[12]

4、网络解耦：

通过引入额外的路径来抵消相互耦合的场，从而达到解耦的目的。这种方法包括使用耦合器、移相器等网络结构，可以有效提高隔离度，但可能增加系统的复杂性和成本。

参考文献[13]-[17]

5、利用自然场特性：

研究贴片天线的自然场特性，通过精心设计天线结构和排列方式，可以在不使用额外解耦结构的情况下实现天线间的隔离。这种方法简单有效，特别适用于天线间距较小、难以实施复杂解耦结构的场景。

参考文献[18]-[24]

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几十年来，紧密排列的天线阵列中的互耦减少一直是研究的热点。随着对高增益天线需求的增加，阵列天线是大多数无线通信系统不可替代的解决方案。阵列天线通常是通过将天线放置在半波长的距离来构建的。为了使天线阵列小型化，有必要减小辐射器之间的间距。这增加了天线元件之间的耦合，导致阻抗和辐射性能差。这种性能的降低归因于表面波从一个天线元件传播到另一个天线单元，从而改变了电流分布。电流分布的改变降低了天线辐射效率。因此，在减小天线间距的情况下封装更多数量的天线总是引起研究兴趣。尽管这是几十年来的研究兴趣，但天线研究人员仍在寻找更优的解决方案，以提高封装密度，同时增强天线元件之间的隔离。