【你们的体验官上线了】Ansys Maxwell 2023最新功能体验系列

6月前浏览15611

本文摘要（由AI生成）：

本文介绍了三个模块的更新点，包括Adaptive time-stepping for nonlinear simulations等功能的更新，Twin Builder模块的Reduced Order Model和Modelica Editor的增强功能，以及Granta模块中Granta Materials Library和Granta Producer Materials Library的更新内容。这些更新旨在提升仿真效率和精度，增强用户体验，并增加新的材料记录和属性，以满足更多实际应用需求。

Ansys 2023已经发布好几个月了，其实发布不久我就安装了，但是因为那时候想着官方宣讲反正也快了，就干脆直摆烂等官方资料出来了再针对性地体验一下。不过几个月过去了，国外的宣讲才刚结束，国内的宣讲拖拖拉拉也一直没出来。我倒是坐得住，群里的小伙伴不干了。好吧，是谁嚷嚷着要我讲新功能的，我这就满足你们。

Ansys Aedt2023版本在全线产品上都有明显的更新，因为我平时不会用到全部的模块所以不会全部详细展开。这里我就先把所有模块的新功能摆出来，感兴趣的可以拉到文末仔细看一下。
从这篇文章开始我会针对maxwell的新功能进行深度体验然后分享体验感受和新功能的使用方法。

Windings in magnetostatic

静态分析中支持绕组设置

Winding也就是绕组，这个概念在maxwell中非常常见，与之相匹配的是coil线圈。Maxwell中，通过对coil和winding的搭配使用可以一定程度上模拟导体的电气连接关系，从而避免了外电路的使用。一般来说，每个winding中可以包含一个或多个coil来模拟多线圈的绕组形式。但是在之前的版本中，涡流场和瞬态场的激励全都支持coil单独添加激励和使用winding来添加激励的功能（图1和图2）。而唯独静磁场中，只能使用Coil而不能使用winding，也就不能通过设置绕组来设置电压或者电流型激励。

图1 涡流场中的激励

图2 瞬态场中的激励

而现在，2023版本中，在二维和三维的静磁场求解器中都可以支持winding的设置了，也就同样支持使用winding来设置电压或者电流型激励。

添加winding的办法与涡流场和瞬态场是相同的，首先定义好Coil Ternimal（图3），然后在模型树的激励上右键-点击Add winding来添加一个绕组（图4），然后在刚才定义的Coil Terminal上右键-Add to Winding（图5），就可以把线圈添加到绕组中了。线圈类型同时支持绞线圈和实体线圈（图6）。

官方给出了这样的一个功能测试结果。

一条磁路上有六个线圈，分别使用涡流场和静磁场设置好winding，涡流场的频率给0.1Hz来等效成一个静磁场，然后进行计算，计算结果显示，使用涡流场计算得到的磁场结果与静态计算完全一致。

感受：虽然大多数产品的工作状态几乎都不会使用静态场来分析，但是静态场作为一个复杂分析的试探性计算还是有些参考价值的，或者可以作为产品分析的初步性能校核。所以总的感受是，这算一个中规中矩的更新吧。

感兴趣的小伙伴，快来自己感受一下吧。如果你也在用最新版本，如果你也发现了功能的更新点，可以在留言中告诉我，我会放在这个系列中一一讲解演示。

附录不同模块的更新

HFSS 模块更新点

Support for modal ports and components in terminal designs

Improved workflows for layout components

Improved HPC performance for distributed mesh fusion solver

Iterative solver option for mesh fusion

Ansys Electronics Desktop 2023 R1

Improved performance of domain solver for large arrays

Option to set phase center at port location

AMD math libraries with direct matrix solver

Improved TDR calculation

Parallel component adaptive for 3D Component arrays (Beta)

Nonlinear Drude model for plasma density in implicit transient (Beta)

SBR+ enhancements:

Custom arrays

Support for PTD/UTD in advanced doppler processing

File-based near field

Near field performance improvements

HFSS 3D Layout 模块更新点

Etching workflow and robustness improvements

Arbitrary backdrill depth

Layout and ECAD usability and performance enhancements

AMD math libraries with direct matrix solver

Iterative solver option for mesh fusion

Improved TDR calculation

Solution management improvements

IC Layout mode (Beta)

Rigid flex multi-zone workflow (Beta)

Support for wave ports in broadband frequency sweep (Beta)

Icepak 模块更新点

Slider bar and HDM meshing enhancements

Graphical monitoring of batch solves

Export of heat transfer coefficients in CTM v2

Export of temperature data from multiple PCBs to Sherlock

ECXML export

Support for altitude effects

Selection of 2D profile interpolation method

New toolkits for snapping and heat sinks

New Getting Started Guides: Finned Heat Sink, RF Amplifier, Optimization of Fan

Location, and Cold Plate Model

ROM Delphi support for BGAs (Beta)

Support for direct post-processing of hybrid meshes (Beta)

Maxwell 模块更新点

Windings in magnetostatic

Force density calculation improvements

Enhanced workflows for co-simulation with Motion

Support for parallel branches in windings with solid conductors

Half-axial symmetry for object-based harmonic force in transient

Improved hp-assignment efficiency for complex geometries in eddy and magnetostatic

ROM-based efficiency map for induction machines in the electric machine toolkit

Electric machine toolkit workflow improvements

Thin layer boundary for 3D DC conduction

TDM support for different time steps between source and target

Option to use Lorentz force calculation in 3D transient

New design setting to skip mesh quality checks

Band mapping angle meshing for 2D transient (Beta)

Mechanical 模块更新点

Thermal contacts

Reference temperature for objects in Structural

Q3D Extractor 模块更新点

Performance improvements for E and H fields

Infinite ground plane for CG

Stability enforcement and passivity check for RLGC SPICE export

Transition region solver for AC-RL (Beta)

Distributed memory solver for CG (Beta)

Circuit 模块更新点

General Enhancements:

Adaptive time-stepping for nonlinear simulations

Tx/Rx support for IBIS-AMI models

Virtual EMI test receiver component (Beta)

Augmented-Data Passivity Enforcement for state-space fitting (Beta)

Automatic tuning of HFSS 3D Layout ports in NuHertz (Beta)

Twin Builder 模块更新点

Reduced Order Model:

Linear Static ROM with support for large number of parameters

Linear Dynamic ROM

Image generation with geometry deformation for ROMs

Modelica Editor:

Enhanced bijection (text-to-diagram) support

Enhanced diagram graphics

General Enhancements:

Support for Hierarchical parameters in the Model Parameter dialog box

Model Exchange (ME) FMU support in Twin Deployer

Support for gradient fitting in device characterization

Carrier wave options in the SVPWM component

Automatic pin connection for large components

Granta 模块更新点

Granta Materials Library:

Ethylene glycol and propylene glycol records are updated with thermal expansion, density

vs. temperature, viscosity vs. temperature and molecular data changes

Missing molecular mass values are populated for all fluids

Temperature dependent Young’s modulus removed for Plastic, PA12 (rigid)

Hc value removed for soft magnets

There are no additional materials/records in the Materials Library in this release, but some

property values are updated as a result of bug fixing

Granta Producer Materials Library:

Ansys Electronics Desktop 2023 R1

Added 8 new PCB laminates from two new producers: Arlon and Taconic

Added 9 new PCB laminates for the existing producers: Rogers, EMC, Shengyi and

Ventec

Added 1 new polymer-elastomer material for the existing producer: Laird

Gap filled some mechanical and thermal properties

END

来源：搞仿真的晴博

著作权归作者所有，欢迎分享，未经许可，不得转载

首次发布时间：2023-04-18

【你们的体验官上线了】Ansys Maxwell 2023最新功能体验系列

静态分析中支持绕组设置

附录 不同模块的更新

附录不同模块的更新