Ansys发布HFSS网格融合功能
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以下文章来源于微波仿真论坛 ，作者ANSYS
先来认识一下一位大牛：
赵克钟 博士，ANSYS首席研发专家。这次推出HFSS Mesh Fusion功能就是赵博士攻破的。
主要亮点
Ansys HFSS Mesh Fusion推出后，将帮助工程师完成超乎想象大规模问题的网格剖分和求解
HFSS Mesh Fusion助力复杂电磁系统实现快速全耦合仿真，从而降低研发成本，促进新一代产品开发，同时不影响设计质量和精度
全新突破性技术帮助工程师改进高端产品应用设计，从自动驾驶到5G通信等场景
Ansys推出HFSS Mesh Fusion，帮助工程团队完成比以往更大规模设计的网格剖分和求解，推动复杂电磁系统实现快速全耦合仿真，从而减少研发费用，加快前沿产品的研发，同时不影响设计质量和精度。
仿真电容传感器阵列的触屏电视面板的电磁干扰室辐射
现代电子产品与过去相比，精密程度进一步提高，具有更高密度、更低电压裕量和更先进的工艺。为了实现创新，工程师必须在实现更小外形尺寸的同时提升功能，保持甚至降低功耗。随着这些设计的难度不断增大，工程师必须解决组件之间以及整个系统之间的复杂相互作用，这对于科技前沿的人工智能机器学习、自动驾驶汽车、5G通信、高性能计算和工业物联网等应用都至关重要。
Ansys 在HFSS 2021 R1版本中推出HFSS Mesh Fusion，帮助工程师将集成电路（IC）、封装、连接器、印刷电路板、天线和平台整合在统一的Ansys HFSS设计中，以预测电磁相互作用。HFSS Mesh Fusion通过在组件级应用最佳网格剖分技术，并可跨核心、集群或在Ansys® Cloud™中运行，突破了以前的障碍。随后，创新型求解器技术将提取全耦合、无损、全波的电磁矩阵。通过求解更复杂设计问题，企业能够满怀信心地突破性能极限，从而开发出前沿产品。
连接器和柔性电缆多PCB系统的信号完整性仿真
三星电子晶圆代工设计技术团队副总裁Sangyun Kim表示：“随着电子系统集成度不断提高，导致对综合电磁系统分析的需求越来越大。Ansys HFSS Mesh Fusion使我们优秀的工程团队能够开发出最优设计，缩短设计周期，降低成本并提高我们向客户交付的价值。借助Mesh Fusion，我们正在创新前所未有的先进设计。实际上，对于客户最新的平板电视产品，我们仿真了整个房间的电磁传输情况。”
HFSS Mesh Fusion能帮助工程师迅速克服极具挑战性的设计难题，并向客户交付业界一流的产品。
Herrick Technology Labs高级工程师Clyde Callewaert表示： “Ansys HFSS能够求解任意复杂性结构，从而实现创造性开拓性设计。全新HFSS Mesh Fusion技术将帮助我们通过HFSS开展更全面的无损仿真，进一步将其确认为我们的 “虚拟实验室” 。有了HFSS，我们只需进入虚拟实验室确认结果，而不是去发掘它们。”
通过求解极其复杂的电磁模型，HFSS Mesh Fusion提供了用于改进最终产品的关键设计数据。
Ansys副总裁兼总经理John Lee称： “HFSS Mesh Fusion有助于IC设计师在全耦合电磁仿真中有效地管理几何细节的容量、复杂性、尺寸范围和密度。这样工程师就能打破陈规，以更高频率和更紧凑的尺寸创新领先设计，有把握地进行流片，并交付功能超出预期的开拓性产品。它还支持众多高度复杂的应用，包括5G通信、自动驾驶等等。”
最近EE杂志对HFSS产品经理Matt Commens针对于HFSS Mesh Fusion的采访：https://www.eejournal.com/fish_fry/a-mesh-by-any-other-name-just-isnt-the-same/
A Mesh By Any Other Name Just Isn’t the Same
Breaking Rules and Making the Impossible Possible with Ansys HFSS Mesh Fusion
by Amelia Dalton
In this week’s Fish Fry podcast, we’re making the impossible possible! We start things off with a closer look at the world’s first metamaterial developed by a team of researchers from EPFL Labs. We investigate the unique properties of this new metamaterial and how this research could pave the way for the development of advanced forms of mechanical metamaterials. Also this week, Matt Commens (Ansys) joins us to discuss HFSS Mesh Fusion. We check out the details of this new mesh fusion technology including how it will open up new avenues for simulation, and why it will help engineers break old rules to overcome the most challenging design obstacles.
https://www.eejournal.com/industry_news/ansys-launches-hfss-mesh-fusion-redefines-product-development-by-enabling-design-of-entire-systems/
January 21, 2021
Ansys Launches HFSS Mesh Fusion, Redefines Product Development by Enabling Design of Entire Systems
Ansys’ new breakthrough technology helps engineers improve product design for advanced applications ranging from autonomous vehicles to 5G communications
PITTSBURGH, PA, January 21, 2021 – Ansys (NASDAQ: ANSS) is helping engineering teams to mesh and solve larger designs than ever with the launch of Ansys HFSS Mesh Fusion. Cutting development expenses and expediting the development of leading-edge products, HFSS Mesh Fusion drives rapid and fully coupled simulation of complex EM systems — without compromising the design or fidelity.
Modern electronic products are more sophisticated than ever, with higher density, lower voltage margins and more advanced processes. To deliver innovation, engineers must increase functionality and maintain or even decrease power consumption within a smaller form factor. As these designs become more challenging, engineers must solve complex interactions between components and across systems, critical for designing cutting-edge artificial intelligence machine learning, autonomous vehicle, 5G communications, high-performance computing and Industrial Internet of Things applications.
HFSS Mesh Fusion, available in Ansys HFSS 2021 R1, helps engineers combine integrated circuits (IC), packaging, connectors, printed circuit boards, antennas and platform in a single Ansys HFSS analysis to predict EM interactions. HFSS Mesh Fusion bypasses previous barriers by applying optimal meshing technology at the component level, parallelized across cores, clusters or within Ansys® Cloud™. A breakthrough solver technology then extracts a fully coupled, uncompromised, full-wave EM matrix. By enabling much more complex designs to be solved, companies can confidently push the limits of performance to create state-of-the-art products.
“Increasing levels of electronic system integration are leading to a greater demand for comprehensive EM system analysis,” said Sangyun Kim, vice president, Foundry Design Technology Team at Samsung Electronics. “Ansys HFSS Mesh Fusion makes it possible for our talented engineering teams to create optimal designs, shrink design cycles and cost and increase the value that we deliver to our customers. Leveraging Mesh Fusion, we are innovating highly advanced designs that were previously unimaginable. In fact, for the customer’s latest flat panel TV, we simulated the EM transmission of an entire room.”
HFSS Mesh Fusion helps engineers swiftly overcome the most challenging design obstacles to deliver best-in-class products to customers.
“Ansys HFSS can solve any structure, regardless of complexity, enabling creative out-of-the-box designs. The new HFSS Mesh Fusion technology will allow us to tackle even more comprehensive, uncompromised simulations with HFSS, further validating it as our ‘virtual laboratory’,” said Clyde Callewaert, senior engineer at Herrick Technology Labs. “Because with HFSS in the loop, we go into the lab to confirm results, not discover them.”
By solving the most complex EM models, HFSS Mesh Fusion delivers critical design data that improves end products.
“HFSS Mesh Fusion helps IC designers effectively manage the capacity, complexity, dimensional range and density of geometric detail in a fully coupled EM simulation,” said John Lee, vice president and general manager at Ansys. “This empowers engineers to break the old rules, innovate leading-edge designs at higher frequencies and within tighter form factors, tape out with confidence and deliver trailblazing products with more functionality than ever thought possible. This supports numerous highly sophisticated applications, including 5G communications, autonomous driving and many more.”
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https://finance.yahoo.com/news/ansys-launches-hfss-mesh-fusion-120000940.html
